As the Flip chip packaging technology (Flip chip) gradually recognized on the market, the current LED many enterprises have already begun into a more "advanced" CSP packaging technology, and it is also expected to cause a new round of packaging industry change.

[source: high LED by December issue of the "good LED products" (total 6) article | Xu Chaopeng ] as Flip chip packaging technology (Flip chip) gradually recognized on the market, the current LED many enterprises have already begun into a more "advanced" CSP packaging technology, and it is also expected to cause a new round of packaging industry change.

On April 19, 1965, journal of Electronics (Electronics Magazine) published on the Magazine engineer Gordon? Moore (Gordon Moore) an article written by the "let fill more integrated circuit components". This paper predicted that the semiconductor chip on the number of transistors and resistors, will remain doubled growth each year.

Since then, Moore's law arises at the historic moment, and the law also revealed that the current information the speed of technological progress.Important composition in the semiconductor industry - the driver IC industry, for example, in its nearly 70 years of development, has experienced from SMD to COB, from Flip - chip to CSP packaging stages of development.

Encapsulation technology and the current, IC industry has the transition to "3 d era", the use of stacked die process, has been completed by the transverse to the longitudinal development stage.